Thin form factor flip chip ball grid array
US6441499B1 · kind B1 · utility
16Cited by
9References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 30, 2000 |
| Grant date | Aug 27, 2002 |
| Priority date | — |
| Expiry date | Aug 30, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/166
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for making a flip chip ball grid array (BGA) package includes the step of thinning a die for matching a composite coefficient of thermal expansion to that of a second level board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.