Measuring instrument and method for measuring patterns on substrates of various thicknesses
US6441911B1 · kind B1 · utility
0Cited by
3References
14Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 11, 2000 |
| Grant date | Aug 27, 2002 |
| Priority date | — |
| Expiry date | Oct 24, 2020 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01B11/0616
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A measuring instrument and a method for measuring patterns on substrates of various thicknesses are described. The measuring instrument comprises an X-Y carriage in which an opening is defined by a peripheral rim. An illumination optical system and multiple optical compensation elements serve to illuminate the measurement region. Multiple storage compartments for the optical compensation elements are shaped on the peripheral rim of the opening of the X-Y carriage. The optical compensation element needed in each case can be removed by the illumination optical system from the associated storage compartment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.