Patent · US Expired

MCM—MLC technology

US6442041B2 · kind B2 · utility

18Cited by

3References

9Claims

0Family size

Assignee

International Business Machines Corporation · US

Inventors

Simone Rehm · Ehningen, DE
Bernd Garden · Schenefeld, DE
Erich Klink · Schenefeld, DE
Gisbert Thomke · Schenefeld, DE
William F. Shutler · Wappingers Falls, US

Key dates

Filing date	Dec 19, 2000
Grant date	Aug 27, 2002
Priority date	—
Expiry date	Dec 19, 2020

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2201/09681
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

Disclosed is a multilayer electronics packaging structure, especially for use in a multi chip module. By forming an overlap of signal conductors by the respective mesh conductors, an improved shielding effect is achieved and coupling between signal conductors is reduced. By increasing the via punch pitch such that multiple wiring channels are formed between adjacent vias, wirability is improved and the number of signal distribution layers may be reduced. The new structure thus shows improved electrical properties over the state-of-the-art structures, combined with a cost reduction of about 35%.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.