Polishing platen equipped with guard ring for chemical mechanical polishing
US6443810B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Apr 11, 2000 |
| Grant date | Sep 3, 2002 |
| Priority date | — |
| Expiry date | Apr 11, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D9/08
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing pad platen that is equipped with a guard ring, or a slurry retaining collar, used in chemical mechanical polishing (CMP) for conserving usage of polishing slurry is described. A method for conserving slurry solution during a CMP process is further described. In the novel polishing pad platen, a guard ring is mounted to the platen by sealiningly engaging an outer periphery of the platen for preventing spilling out of slurry solution during a polishing operation. The guard ring is mounted to slidingly engage the platen in such a way that the ring may be lowered to be completely out of the way during a pad condition process in which the spinning out of a pad conditioning solution from a top surface of the polishing pad is necessary.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.