Method of cleaning a semiconductor substrate
US6444047B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Jan 3, 2000 |
| Grant date | Sep 3, 2002 |
| Priority date | — |
| Expiry date | Jan 3, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S134/902
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
A method of cleaning a semiconductor substrate is disclosed. The method comprises setting a substrate to-be-treated substantially in parallel to ends of multi-nozzles including an inner tube nozzle and an outer tube nozzle to oppose each other, cleaning the substrate by discharging, to the substrate, a chemical fluid, a combination of chemical fluid and a gas, pure water, or a combination of pure water and a gas through the outer tube nozzle and simultaneously discharging a chemical fluid, a combination of a chemical fluid and a gas, pure water, or a combination of pure water and a gas through the inner tube nozzle, and washing the substrate by discharging pure water to the substrate through at least one of the inner tube nozzle and the outer tube nozzle.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.