Semiconductor sensor device and method of manufacturing the same
US6444543B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 30, 2001 |
| Grant date | Sep 3, 2002 |
| Priority date | — |
| Expiry date | May 30, 2021 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01P2015/0814
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Plural semiconductor chips such as acceleration sensor chips formed on the first surface of a substrate are separated into individual pieces by dicing the substrate from the second surface thereof. A groove surrounding each sensor chip, along which the sensor chip is diced out, is formed at the same time the sensor chip is formed on the first surface. Before dicing, a protecting sheet covering the first surface is pasted along the sidewalls and the bottom wall of the groove. The groove is made sufficiently wide to ensure that the protecting sheet is bent along the walls of the groove without leaving a space between the groove and the protecting sheet. Thus, dicing dusts generated in the dicing process are prevented from being scattered and entering the sensor chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.