Method for forming solder bumps for flip-chip bonding by using perpendicularly laid masking strips
US6444561B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 2, 2000 |
| Grant date | Sep 3, 2002 |
| Priority date | — |
| Expiry date | Oct 14, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10674
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for forming solder bumps for a flip-chip bonding process wherein the bumps have substantially the same height and structures formed by the method are described. In the method, a pre-processed semiconductor substrate that has a plurality of metal traces formed on a top surface is first provided. At least two solder non-wettable masking strips are then deposited on top of and perpendicular to the plurality of metal traces. The at least two solder non-wettable masking strips are deposited spaced-apart at a predetermined spacing sufficient for forming a bond pad therein-between on the plurality of metal traces. Finally, a solder material is deposited onto the bond pads forming solder bumps which are then reflown into solder balls.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.