Inventor · Hengshan, TW

Chia-Chung Wang

104Patents
12h-index
15Co-inventors
83Inventor score

Filing activity: Aug 30, 1995 → Aug 22, 2019

Most-cited inventions

PatentTitleAreaCited byStatus
US6590282B1 Stacked semiconductor package formed on a substrate and method for fabrication Electricity 107 Expired
US8525214B2 Semiconductor chip assembly with post/base heat spreader with thermal via Electricity 54 Active
US7446419B1 Semiconductor chip assembly with welded metal pillar of stacked metal balls Electricity 29 Active
US6876072B1 Semiconductor chip assembly with chip in substrate cavity Electricity 29 Expired
US7494843B1 Method of making a semiconductor chip assembly with thermal conductor and encapsulant grinding Electricity 17 Active
US7948076B2 Semiconductor chip assembly with post/base heat spreader and vertical signal routing Electricity 16 Active
US8865525B2 Method of making cavity substrate with built-in stiffener and cavity substrate manufactured thereby Emerging Cross-Sectional Technologies 15 Active
US7319265B1 Semiconductor chip assembly with precision-formed metal pillar Electricity 14 Active
US8129742B2 Semiconductor chip assembly with post/base heat spreader and plated through-hole Electricity 13 Active
US6872591B1 Method of making a semiconductor chip assembly with a conductive trace and a substrate Electricity 13 Expired
US7656031B2 Stackable semiconductor package having metal pin within through hole of package Electricity 12 Active
US8003415B2 Method of making a semiconductor chip assembly with a post/base heat spreader and vertical signal routing Electricity 12 Active
US10420204B2 Wiring board having electrical isolator and moisture inhibiting cap incorporated therein and method of making the same Electricity 10 Active
US9318411B2 Semiconductor package with package-on-package stacking capability and method of manufacturing the same Electricity 10 Active
US7075186B1 Semiconductor chip assembly with interlocked contact terminal Emerging Cross-Sectional Technologies 9 Expired
US5583263A Process of making ketones Chemistry; Metallurgy 9 Expired
US9209154B2 Semiconductor package with package-on-package stacking capability and method of manufacturing the same Electricity 8 Active
US7811863B1 Method of making a semiconductor chip assembly with metal pillar and encapsulant grinding and heat sink attachment Electricity 8 Active
US7414319B2 Semiconductor chip assembly with metal containment wall and solder terminal Emerging Cross-Sectional Technologies 8 Active
US6444561B1 Method for forming solder bumps for flip-chip bonding by using perpendicularly laid masking strips Electricity 8 Expired
US8076182B2 Method of making a semiconductor chip assembly with a post/base heat spreader and a cavity over the post Electricity 8 Active
US10134711B2 Thermally enhanced semiconductor assembly with three dimensional integration and method of making the same Electricity 8 Active
US8324723B2 Semiconductor chip assembly with bump/base heat spreader and dual-angle cavity in bump Electricity 7 Active
US8324653B1 Semiconductor chip assembly with ceramic/metal substrate Electricity 7 Active
US7419851B2 Method of making a semiconductor chip assembly with a metal containment wall and a solder terminal Emerging Cross-Sectional Technologies 7 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.