Structure and method for electrical method of determining film conformality
US6445194B1 · kind B1 · utility
5Cited by
16References
50Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 16, 2001 |
| Grant date | Sep 3, 2002 |
| Priority date | — |
| Expiry date | Feb 24, 2021 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11C2029/0403
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention provides a monitor wafer and a method using the wafer to measure the conformality of dielectric films and in particular, for measuring the sidewall deposition thickness of dielectric films.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.