Three dimensional lead inspection system
US6445518B1 · kind B1 · utility
4Cited by
3References
14Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 28, 2000 |
| Grant date | Sep 3, 2002 |
| Priority date | — |
| Expiry date | Feb 20, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K13/0812
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A semiconductor device lead inspection apparatus and method are provided for capturing images of the semiconductor edges and leads along two optical axes which have different directions in a plane perpendicular to the semiconductor device edge. A first image is reflected off an optical surface of a prism to a direction corresponding to the camera optical axis. A second image is reflected by two optical surfaces of the prism to a direction corresponding to the camera optical axis.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.