Carriers with concentric balloons supporting a diaphragm
US6447368B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 20, 2000 |
| Grant date | Sep 10, 2002 |
| Priority date | — |
| Expiry date | Apr 10, 2021 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B49/04
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The invention is a chemical-mechanical polishing wafer carrier that is able to apply a plurality of different pressures, with minimal discontinuities at the interfaces between different pressures, through a diaphragm to a back surface of a wafer. A plurality of concentric balloons, that may be individually pressurized, is used to support and press on the back surface of the diaphragm. The walls of the balloons are preferably thin and elastic and preferably do not attach to the diaphragm. This helps to minimize any pressure discontinuities on the diaphragm along the interfaces between the balloons. A wafer may be placed against the front surface of the diaphragm allowing the front surface of the diaphragm to retain and press against the back surface of the wafer during a planarization process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.