Patent · US Expired

Method for producing joined body of ALN substrates and joining agent used for the joining

US6447626B1 · kind B1 · utility

13Cited by
2References
3Claims
0Family size

Assignee

Inventor

Key dates

Filing dateDec 15, 1999
Grant dateSep 10, 2002
Priority date
Expiry dateDec 15, 2019

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC04B2237/80
  • WIPO fieldMaterials, metallurgy
  • WIPO sectorChemistry

Abstract

A novel method for joining aluminum nitride-series substrates to each other is provided in the substantial absence of an intervening third layer at the joining interface between the substrates. In the method, the aluminum nitride-series substrates are joined to each other by interposing a joining agent between the substrates heating the substrates and the joining agent to a first temperature range of at least the melting point of the joining agent to melt the joining agent and liquefy particles of the aluminum nitride at the neighborhood of the interfaces between the melted joining agent and the substrates, and then heating the joining agent and the substrates to a temperature range higher than the temperature range of the first process but lower than the melting point of the substrates to exhaust the joining agent from between the substrates.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.