Methods and apparatus for end-point detection
US6447668B1 · kind B1 · utility
71Cited by
17References
36Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 12, 2000 |
| Grant date | Sep 10, 2002 |
| Priority date | — |
| Expiry date | May 12, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/7684
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An apparatus for detecting the end-point of an electropolishing process of a metal layer formed on a wafer includes an end-point detector. The end-point detector is disposed adjacent the nozzle used to electropolish the wafer. In one embodiment, the end-point detector is configured to measure the optical reflectivity of the portion of the wafer being electropolished.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.