ACM RESEARCH, INC.
🏢 View company profile →17Patents
5Active
17Granted
37Portfolio score
Filing activity: Jan 15, 1999 → Jul 16, 2021
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6391166B1 | Plating apparatus and method | Chemistry; Metallurgy | 243 | Expired |
| US6395152B1 | Methods and apparatus for electropolishing metal interconnections on semiconductor devices | Electricity | 166 | Expired |
| US6440295B1 | Method for electropolishing metal on semiconductor devices | Electricity | 135 | Expired |
| US6248222A | Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workpieces | Chemistry; Metallurgy | 95 | Expired |
| US6726823B1 | Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workpieces | Chemistry; Metallurgy | 71 | Expired |
| US6447668B1 | Methods and apparatus for end-point detection | Electricity | 71 | Expired |
| US6638863B2 | Electropolishing metal layers on wafers having trenches or vias with dummy structures | Electricity | 25 | Expired |
| US6495007B2 | Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workplaces | Chemistry; Metallurgy | 19 | Expired |
| US6837984B2 | Methods and apparatus for electropolishing metal interconnections on semiconductor devices | Electricity | 6 | Expired |
| US6749728B2 | Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workpieces | Chemistry; Metallurgy | 4 | Expired |
| US7136173B2 | Method and apparatus for end-point detection | Electricity | 3 | Expired |
| US7119008B2 | Integrating metal layers with ultra low-K dielectrics | Electricity | 2 | Expired |
| US11037804B2 | Methods and apparatus for cleaning substrates | Emerging Cross-Sectional Technologies | 1 | Active |
| US11581205B2 | Methods and system for cleaning semiconductor wafers | Electricity | 1 | Active |
| US10910244B2 | Methods and system for cleaning semiconductor wafers | Electricity | 1 | Active |
| US11103898B2 | Methods and apparatus for cleaning substrates | Performing Operations; Transporting | 0 | Active |
| US11638937B2 | Methods and apparatus for cleaning substrates | Performing Operations; Transporting | 0 | Active |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.