Method of uniformly depositing seed and a conductor and the resultant printed circuit structure
US6447914B1 · kind B1 · utility
2Cited by
3References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 3, 2000 |
| Grant date | Sep 10, 2002 |
| Priority date | — |
| Expiry date | Aug 21, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31515
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention comprises a method of making a circuitized structure. The method comprises the steps of providing a substrate coated with a polymeric dielectric layer, treating the substrate with alkali, baking the substrate to modify the surface of the polymeric dielectric layer, applying a seed layer to the polymeric dielectric layer and applying conductive layer to the seed layer. The invention also comprises a printed circuit structure produced by the method of the present invention.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.