Modules with pins and methods for making modules with pins
US6448106B1 · kind B1 · utility
20Cited by
46References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 9, 1999 |
| Grant date | Sep 10, 2002 |
| Priority date | — |
| Expiry date | Nov 9, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10704
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Device modules with pins and methods for making device modules with pins are disclosed. One embodiment is directed to a method including forming a polymeric circuit structure having a first side and a second side on a substrate. The formed first side is adjacent to the substrate. A pin is bonded to the second side of the polymeric circuit structure. At least a portion of the substrate is removed to expose at least a portion of the first side of the polymeric circuit structure, and a device is mounted on the first side of the polymeric circuit structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.