Method and system for generating a plurality of donor wafers and handle wafers prior to an order being placed by a customer
US6448152B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 16, 2001 |
| Grant date | Sep 10, 2002 |
| Priority date | — |
| Expiry date | Jul 16, 2021 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG05B2219/45031
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for generating a plurality of donor wafers and handle wafers prior to an order being placed by a customer. For example, a plurality of donor wafers with different silicon layer thicknesses along with a plurality of handle wafers with different oxide layer thicknesses are fabricated. Subsequently, a customer may place an order for silicon-on-insulator (SOI) wafers which share defined parameters. Therefore, a prefabricated donor wafer and handle wafer are selected based on the customer's defined parameters and then bonded together. Next, the donor wafer is cleaved from the handle wafer wherein the handle wafer retains the silicon layer of the donor wafer. The silicon layer thickness of the handle wafer may be altered to meet the customer's parameters. For example, an epitaxial smoothing process may decrease the silicon layer thickness while an epitaxial thickening process may increase the silicon layer thickness.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.