Temperature control structure
US6448575B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 2, 2000 |
| Grant date | Sep 10, 2002 |
| Priority date | — |
| Expiry date | Feb 2, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor structure for controlling the temperature of a component is described. The structure includes a resistive layer having one or more channels provided therein and having a resistance characteristic such that a signal applied thereto causes the resistive layer to generate heat. A cooling fluid is fed through the one or more channels to cool both the structure and a component disposed on the structure. By providing the cooling channels in the resistive layer, the heating and cooling sources are intermingled. The structure can optionally include precising and vacuum clamping structures, to locate and hold the component that is to be temperature controlled.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.