Semiconductor acceleration sensor
US6448624B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 8, 1997 |
| Grant date | Sep 10, 2002 |
| Priority date | — |
| Expiry date | Aug 8, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A semiconductor sensor chip is provided with a weight portion supported in a frame via beams whereby acceleration up to substantially ±1 G can be detected by utilizing piezoresistance effect of resistor elements formed on the beams. The semiconductor sensor chip is supported by a seat having a thermal expansion coefficient equivalent to that of the semiconductor sensor chip via the frame. The frame and the seat are adhered to each other by a flexible adhesive agent mixed with a plurality of resin beads functioning as spacers and under an adhesion state, air damping of the weight portion is carried out by setting a dimension of an air gap between the weight portion and the seat to a range of 7 through 15 &mgr;m.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.