Metal coated markings on integrated circuit devices
US6448632B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 28, 2000 |
| Grant date | Sep 10, 2002 |
| Priority date | — |
| Expiry date | Aug 28, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device comprising a mark located on a surface of the semiconductor device and a metal layer covering the marked surface and the mark. The metal layer functions to protect the semiconductor device from exposure to electromagnetic radiation and allows the mark to be visible for identification purposes. The present invention also pertains a method of manufacturing the semiconductor device as described. The method involves forming a mark on a semiconductor substrate surface of the device and covering the semiconductor substrate surface and the mark with a layer of metal so that the device is protected from exposure to electromagnetic radiation and allows the mark to be visible for identification purposes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.