Ken Pham
33Patents
9h-index
31Co-inventors
75Inventor score
Filing activity: Aug 28, 2000 → Aug 12, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6989122B1 | Techniques for manufacturing flash-free contacts on a semiconductor package | Electricity | 58 | Expired |
| US7714418B2 | Leadframe panel | Electricity | 54 | Active |
| US6624507B1 | Miniature semiconductor package for opto-electronic devices | Electricity | 32 | Expired |
| US6448632B1 | Metal coated markings on integrated circuit devices | Electricity | 27 | Expired |
| US6802654B1 | Electrical connector for opto-electronic modules | Electricity | 20 | Expired |
| US6595699B1 | Optoelectronic package with controlled fiber standoff | Electricity | 19 | Expired |
| US6655854B1 | Optoelectronic package with dam structure to provide fiber standoff | Electricity | 15 | Expired |
| US6749345B1 | Apparatus and method for electro-optical packages that facilitate the coupling of optical cables to printed circuit boards | Physics | 13 | Expired |
| US7918378B1 | Wire bonding deflector for a wire bonder | Emerging Cross-Sectional Technologies | 12 | Active |
| US6642613B1 | Techniques for joining an opto-electronic module to a semiconductor package | Electricity | 7 | Expired |
| US6932136B1 | Post singulation die separation apparatus and method for bulk feeding operation | Emerging Cross-Sectional Technologies | 6 | Expired |
| US6916121B2 | Optical sub-assembly for optoelectronic modules | Electricity | 5 | Expired |
| US7023705B2 | Ceramic optical sub-assembly for optoelectronic modules | Electricity | 4 | Expired |
| US6628000B1 | Techniques for maintaining parallelism between optical and chip sub-assemblies | Physics | 4 | Expired |
| US7086788B2 | Optical sub-assembly for opto-electronic modules | Electricity | 3 | Expired |
| US7045035B1 | Post singulation die separation apparatus and method for bulk feeding operation | Emerging Cross-Sectional Technologies | 3 | Expired |
| US7001083B1 | Technique for protecting photonic devices in optoelectronic packages with clear overmolding | Emerging Cross-Sectional Technologies | 3 | Expired |
| US7247942B2 | Techniques for joining an opto-electronic module to a semiconductor package | Electricity | 3 | Expired |
| US6858468B2 | Techniques for joining an opto-electronic module to a semiconductor package | Electricity | 2 | Expired |
| US10312184B2 | Semiconductor systems having premolded dual leadframes | Electricity | 1 | Active |
| US7195955B2 | Technique for protecting photonic devices in optoelectronic packages with clear overmolding | Emerging Cross-Sectional Technologies | 1 | Expired |
| US6973225B2 | Techniques for attaching rotated photonic devices to an optical sub-assembly in an optoelectronic package | Electricity | 1 | Expired |
| US6838317B2 | Techniques for joining an opto-electronic module to a semiconductor package | Electricity | 1 | Expired |
| US7199440B2 | Techniques for joining an opto-electronic module to a semiconductor package | Electricity | 0 | Expired |
| US8283760B1 | Lead frame interconnect scheme with high power density | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.