Pressure-bonded heat-sink system
US6448642B1 · kind B1 · utility
Inventors
Key dates
| Filing date | Jan 27, 2000 |
| Grant date | Sep 10, 2002 |
| Priority date | — |
| Expiry date | Jan 27, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8582
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
This invention pertains to a method for removing heat from a heat source device and to a heat sink system characterized by a pressure bond having thermal resistance of less than about 5 K/kW-cm2. The method is characterized by the steps of removing heat from a heat source device comprising the steps of placing a heat source device in contact with a heat source and applying a sufficient force to form a pressure bond between the heat source device and the heat sink wherein thermal resistance at the interface between the heat source device and the heat sink after the thermal bond is established is less than about 5 K/kW-cm2. The heat sink system includes a heat source device and a heat sink in contact with the heat source device with thermal resistance at the interface of the heat source device and said heat sink is less than about 5 K/kW-cm2.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.