High capacity memory module with higher density and improved manufacturability
US6449166B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 24, 2000 |
| Grant date | Sep 10, 2002 |
| Priority date | — |
| Expiry date | Aug 24, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1572
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention provides a double-sided memory module with improved memory device density and improved manufacturability, and with optional bus terminations mounted directly on the memory module for use with high speed, impedance-controlled memory buses. It also allows the same memory devices to be used on both sides of the card, instead of requiring memory devices with mirrored I/O connections on a second side as on prior art double-sided memory cards. The memory module may be formed on a conventional printed circuit card using cost-effective printed circuit board line widths and spaces with unpacked or packed memory chips attached directly to the memory module, while maintaining good signal integrity. Using memory modules with bus terminations mounted directly on the module improves the signal quality and integrity even further and therefore enhances system performance. Such designs may also eliminate the need for bus exit connections, thereby allowing the freed-up connection capacity to be used to address additional memory capacity on the module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.