High Connection Density Inc.
26Patents
0Active
26Granted
34Portfolio score
Filing activity: Dec 9, 1999 → Jan 24, 2003
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6264476A | Wire segment based interposer for high frequency electrical connection | Electricity | 125 | Expired |
| US6705877B1 | Stackable memory module with variable bandwidth | Electricity | 118 | Expired |
| US6551112B1 | Test and burn-in connector | Emerging Cross-Sectional Technologies | 110 | Expired |
| US6545895B1 | High capacity SDRAM memory module with stacked printed circuit boards | Electricity | 91 | Expired |
| US6712621B2 | Thermally enhanced interposer and method | Electricity | 88 | Expired |
| US6439894B1 | Contact assembly for land grid array interposer or electrical connector | Electricity | 36 | Expired |
| US6480014B1 | High density, high frequency memory chip modules having thermal management structures | Emerging Cross-Sectional Technologies | 34 | Expired |
| US6663399B2 | Surface mount attachable land grid array connector and method of forming same | Emerging Cross-Sectional Technologies | 34 | Expired |
| US6722893B2 | Test and burn-in connector | Emerging Cross-Sectional Technologies | 32 | Expired |
| US6312266A | Carrier for land grid array connectors | Emerging Cross-Sectional Technologies | 29 | Expired |
| US6712620B1 | Coaxial elastomeric connector system | Emerging Cross-Sectional Technologies | 24 | Expired |
| US6846184B2 | Low inductance electrical contacts and LGA connector system | Electricity | 24 | Expired |
| US6597062B1 | Short channel, memory module with stacked printed circuit boards | Electricity | 21 | Expired |
| US6381164B1 | Low profile, high density memory system | Electricity | 21 | Expired |
| US6659778B2 | Contact assembly for land grid array interposer or electrical connector | Electricity | 21 | Expired |
| US6471525B1 | Shielded carrier for land grid array connectors and a process for fabricating same | Electricity | 19 | Expired |
| US6449166B1 | High capacity memory module with higher density and improved manufacturability | Electricity | 17 | Expired |
| US6540525B1 | High I/O stacked modules for integrated circuits | Electricity | 16 | Expired |
| US6370770B1 | Carrier for land grid array connectors | Emerging Cross-Sectional Technologies | 12 | Expired |
| US6661690B2 | High capacity memory module with built-in performance enhancing features | Electricity | 11 | Expired |
| US6496380B1 | High capacity memory module with high electrical design margins | Electricity | 10 | Expired |
| US6723927B1 | High-reliability interposer for low cost and high reliability applications | Electricity | 9 | Expired |
| US6590159B2 | Compact stacked electronic package | Electricity | 7 | Expired |
| US6638077B1 | Shielded carrier with components for land grid array connectors | Emerging Cross-Sectional Technologies | 7 | Expired |
| US6546625B1 | Method of forming a contact member cable | Emerging Cross-Sectional Technologies | 1 | Expired |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.