Mechanism that holds down packages
US6452409B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 8, 2000 |
| Grant date | Sep 17, 2002 |
| Priority date | — |
| Expiry date | Oct 5, 2020 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2896
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An arrangement and method for pressing down a semiconductor package arrangement with a controlled down-force balances a pressure bar on a fulcrum. The pressure bar is biased by a spring in a first direction downwardly towards a semiconductor package to be held. An adjustment device limits the amount of rotation of the pressure bar around the fulcrum. An adjustment device controls moves the limit of rotation of the pressure bar around the fulcrum so that the pressure applied by the spring and pressure bar against the semiconductor package may be precisely controlled. This controlling of the pressure applied against the semiconductor package allows for a consistency of testing during the electrical characterization testing of the semiconductor package and eliminates the manual holding down of the package during testing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.