Method and apparatus for a wafer carrier having an insert
US6454635B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 8, 2000 |
| Grant date | Sep 24, 2002 |
| Priority date | — |
| Expiry date | Nov 8, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4973
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for repairing a wafer carrier after plural processing operations during which the carrier holds a plurality of semiconductor wafers in a processing apparatus which removes wafer material by at least one of abrading and chemical reaction. The wafer carrier has holes for receiving respective ones of the wafers and removable annular inserts for each hole. Each insert is receivable in a respective one of the holes for engaging a peripheral edge of one of the wafers. The thickness of the insert is reduced during the successive processing operations. The method includes removing at least one of the inserts from the wafer carrier and installing at least one new insert in the wafer carrier having a thickness substantially greater than a minimum thickness to extend the useful life of the wafer carrier and to improve the flatness and parallelism of surfaces of wafers processed using the wafer carrier.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.