Semiconductor device having a ball grid array and a fabrication process thereof
US6455920B2 · kind B2 · utility
37Cited by
5References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 25, 1998 |
| Grant date | Sep 24, 2002 |
| Priority date | — |
| Expiry date | Sep 25, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/978
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device has a resin package layer on a principal surface of a semiconductor chip, on which a number of bump electrodes are formed, wherein the semiconductor device has a chamfer surface or a stepped surface on a top edge part such that the external shock or stress applied to such an edge part is dissipated by the chamfer surface of the stepped surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.