Hirohisa Matsuki
48Patents
17h-index
61Co-inventors
84Inventor score
Filing activity: May 31, 1990 → Dec 27, 2017
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5065223A | Packaged semiconductor device | Electricity | 189 | Expired |
| US5969424A | Semiconductor device with pad structure | Electricity | 155 | Expired |
| US6218281A | Semiconductor device with flip chip bonding pads and manufacture thereof | Electricity | 102 | Expired |
| US6232147A | Method for manufacturing semiconductor device with pad structure | Electricity | 77 | Expired |
| US7084513B2 | Semiconductor device having a plurality of semiconductor chips and method for manufacturing the same | Electricity | 64 | Expired |
| US7064436B2 | Semiconductor device and method of fabricating the same | Electricity | 63 | Expired |
| US6548898B2 | External connection terminal and semiconductor device | Electricity | 61 | Expired |
| US6881611B1 | Method and mold for manufacturing semiconductor device, semiconductor device and method for mounting the device | Electricity | 40 | Expired |
| US6455920B2 | Semiconductor device having a ball grid array and a fabrication process thereof | Emerging Cross-Sectional Technologies | 37 | Expired |
| US6344407B1 | Method of manufacturing solder bumps and solder joints using formic acid | Electricity | 35 | Expired |
| US6909181B2 | Light signal processing system | Emerging Cross-Sectional Technologies | 34 | Expired |
| US6836025B2 | Semiconductor device configured to be surface mountable | Electricity | 34 | Expired |
| US6469370B1 | Semiconductor device and method of production of the semiconductor device | Electricity | 30 | Expired |
| US7064645B2 | Electronic device | Electricity | 29 | Expired |
| US6472744B2 | Semiconductor module including a plurality of semiconductor devices detachably | Electricity | 21 | Expired |
| US6666369B2 | Semiconductor device manufacturing method, electronic parts mounting method and heating/melting process equipment | Electricity | 20 | Expired |
| US6566239B2 | Semiconductor device manufacturing method having a step of forming a post terminal on a wiring by electroless plating | Electricity | 19 | Expired |
| US6471501B1 | Mold for fabricating semiconductor devices | Electricity | 17 | Expired |
| US6680241B2 | Method of manufacturing semiconductor devices by dividing wafer into chips and such semiconductor devices | Electricity | 17 | Expired |
| US7112889B1 | Semiconductor device having an alignment mark formed by the same material with a metal post | Emerging Cross-Sectional Technologies | 16 | Expired |
| US6939142B2 | Semiconductor device testing contactor having a circuit-side contact piece and test-board-side contact piece | Emerging Cross-Sectional Technologies | 16 | Expired |
| US6784543B2 | External connection terminal and semiconductor device | Electricity | 15 | Expired |
| US8952538B2 | Semiconductor device and method for manufacturing the same | Electricity | 15 | Active |
| US6732911B2 | Solder jointing system, solder jointing method, semiconductor device manufacturing method, and semiconductor device manufacturing system | Electricity | 14 | Expired |
| US6511620B1 | Method of producing semiconductor devices having easy separability from a metal mold after molding | Electricity | 13 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.