Microelectromechanical elevating structures
US6456420B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Jul 27, 2000 |
| Grant date | Sep 24, 2002 |
| Priority date | — |
| Expiry date | Sep 23, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01H2059/0081
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A MEMS apparatus is provided that includes a microelectronic substrate and an elevating structure having a fixed portion attached to the substrate and a distal portion raised from the surface of the substrate. The distal portion of the elevating structure defines at least one zone of attachment. Additionally, the MEMS apparatus comprises a MEMS device attached to the distal portion of the elevating structure at one of the zones of attachment. The attached MEMS device may comprise an electrostatic actuator having a first and second electrode film that are attached to the elevating structure at one of the zones of attachment. In those embodiments in which the MEMS devices comprise an electrostatic actuator the force and movement provided by the actuator may be used to incorporate switches, pumps, valves or other similar MEMS devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.