Patent · US Expired

Method for regenerating semiconductor wafers

US6458712B2 · kind B2 · utility

5Cited by

6References

9Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Hans Kramer · Ede, NL
Matthias Taubert · Radebeul, DE
Gernot Loibnegger · Radeberg, DE

Key dates

Filing date	Feb 28, 2001
Grant date	Oct 1, 2002
Priority date	—
Expiry date	Feb 28, 2021

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB24C3/322
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

A process is described for recycling test wafers used for quality control or damaged wafers used in the context of chip production by regenerative removal of the previously applied layers. The method is based on the object of developing a cost-effective, environmentally friendly and time-saving regeneration method. The object is achieved by removing the applied layers by wet blasting using a specific blast material.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.