Laminate circuit structure and method of fabricating
US6459047B1 · kind B1 · utility
14Cited by
22References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 5, 2001 |
| Grant date | Oct 1, 2002 |
| Priority date | — |
| Expiry date | Sep 5, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A substrate and a method of making the substrate is provided. The substrate includes a layer of metal with at least one through hole therein, the layer of metal having an adhesion promoting layer thereon. A layer of a partially cured low-loss polymer or polymer precursor is positioned on the adhesion promoting layer and a plurality of conductive circuit lines are positioned on a portion of the partially cured dielectric layer. The substrate can be used as a building block in the fabrication of a multilayered printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.