Patent · US Expired

Bondhead for a wire bonder

US6460751B1 · kind B1 · utility

11Cited by
10References
22Claims
0Family size

Assignee

Inventor

Key dates

Filing dateOct 24, 2000
Grant dateOct 8, 2002
Priority date
Expiry dateOct 24, 2020

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L2924/01082
  • WIPO fieldMachine tools
  • WIPO sectorMechanical engineering

Abstract

A Wire Bonder contains a bondhead which comprises a slide, a rotary beam rotatable on a vertical axis and a rocker mounted on the rotary beam. The slide is movable back and forth in a predetermined horizontal direction and moves the rotary beam with it. The slide preferably bears on a horizontally arranged glide plate by means of an air bearing charged with vacuum. The rotary beam also preferably bears on the glide plate by means of a further air bearing charged with vacuum. A drive arranged on the slide is preferably foreseen for the rotating movement of the rotary beam.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.