Bump forming method and apparatus therefor
US6460755B1 · kind B1 · utility
39Cited by
24References
7Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Mar 7, 1997 |
| Grant date | Oct 8, 2002 |
| Priority date | — |
| Expiry date | Mar 7, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/082
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
There are disclosed a solder bump forming method and an apparatus therefor, which achieve a high reliability, and an electronic part, produced by this method and this apparatus, is also disclosed. For each of the step of arraying solder balls, the step of supplying a flux, and the step of mounting the solder balls on a board, it is checked whether or not any solder ball is omitted, and the process is conducted while confirming the condition of the operation, thereby enhancing the reliability and also preventing defective products from being produced.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.