Hitoshi Odashima
10Patents
6h-index
39Co-inventors
62Inventor score
Filing activity: Feb 19, 1985 → Mar 10, 2003
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6629553B2 | Method and system for mounting semiconductor device, semiconductor device separating system, and method for fabricating IC card | Emerging Cross-Sectional Technologies | 174 | Expired |
| US5279045A | Minute particle loading method and apparatus | Electricity | 53 | Expired |
| US6460755B1 | Bump forming method and apparatus therefor | Electricity | 39 | Expired |
| US4620663A | Parts-connecting apparatus using solder | Emerging Cross-Sectional Technologies | 13 | Expired |
| US6406357B1 | Grinding method, semiconductor device and method of manufacturing semiconductor device | Electricity | 11 | Expired |
| US7265035B2 | Semiconductor device and its manufacturing method | Electricity | 10 | Expired |
| US6203655A | Thin electronic circuit component and method and apparatus for producing the same | Emerging Cross-Sectional Technologies | 6 | Expired |
| US4882833A | Method and apparatus for mounting coils inside a hollow cylindrical article | Emerging Cross-Sectional Technologies | 3 | Expired |
| US6602736B1 | Method and apparatus for separating semiconductor chips | Emerging Cross-Sectional Technologies | 3 | Expired |
| US6551449B2 | Thin electronic circuit component and method and apparatus for producing the same | Emerging Cross-Sectional Technologies | 1 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.