Process for mounting electronic device and semiconductor device
US6461896B1 · kind B1 · utility
17Cited by
3References
9Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | May 5, 2000 |
| Grant date | Oct 8, 2002 |
| Priority date | — |
| Expiry date | May 5, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49146
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic device comprising a semiconductor chip which is fixed to the mounting face of a wiring board through an adhesive and in which external terminals are electrically connected with electrode pads of the wiring board through bump electrodes. Recesses are formed in the electrode pads, and in the recesses the electrode pads and the bump electrodes are connected. The electrode pads are formed over the surface of a soft layer, and the recesses are formed by elastic deformation of the electrode pads and the soft layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.