Hot wall rapid thermal processor
US6462310B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 11, 2000 |
| Grant date | Oct 8, 2002 |
| Priority date | — |
| Expiry date | Aug 11, 2020 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF27D2003/0075
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An apparatus for heat treatment of a wafer is disclosed. The apparatus includes a heating chamber having a heat source. A cooling chamber is positioned adjacent to the heating chamber and includes a cooling source. A wafer holder is. configured to move between the cooling chamber and the heating chamber through a passageway and one or more shutters defines the size of the passageway. The one or more shutters are movable between an open position where the wafer holder can pass through the passageway and an obstructing position which defines a passageway which is smaller than the passageway defined when the shutter is in the open position.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.