ASML US, LLC
24Patents
5Active
24Granted
36Portfolio score
Filing activity: Dec 29, 1998 → Aug 27, 2018
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6462310B1 | Hot wall rapid thermal processor | Mechanical Engineering; Lighting; Heating | 272 | Expired |
| US6660391B1 | Low &kgr; dielectric inorganic/organic hybrid films and method of making | Emerging Cross-Sectional Technologies | 54 | Expired |
| US6411426B1 | Apparatus, system, and method for active compensation of aberrations in an optical system | Physics | 31 | Expired |
| US6476921B1 | In-situ method and apparatus for end point detection in chemical mechanical polishing | Performing Operations; Transporting | 30 | Expired |
| US6610150B1 | Semiconductor wafer processing system with vertically-stacked process chambers and single-axis dual-wafer transfer system | Emerging Cross-Sectional Technologies | 30 | Expired |
| US6544345B1 | Method and system for in-situ cleaning of semiconductor manufacturing equipment using combination chemistries | Emerging Cross-Sectional Technologies | 28 | Expired |
| US6521048B2 | Single body injector and deposition chamber | Chemistry; Metallurgy | 28 | Expired |
| US6507390B1 | Method and apparatus for a reticle with purged pellicle-to-reticle gap | Physics | 20 | Expired |
| US6398373B1 | Pneumatic control system and method for shaping deformable mirrors in lithographic projection systems | Emerging Cross-Sectional Technologies | 19 | Expired |
| US6458013B1 | Method of chemical mechanical polishing | Performing Operations; Transporting | 18 | Expired |
| US6533531B1 | Device for handling wafers in microelectronic manufacturing | Emerging Cross-Sectional Technologies | 18 | Expired |
| US6729353B2 | Modular fluid delivery apparatus | Emerging Cross-Sectional Technologies | 15 | Expired |
| US6556281B1 | Flexible piezoelectric chuck and method of using the same | Physics | 12 | Expired |
| US6492621B2 | Hot wall rapid thermal processor | Mechanical Engineering; Lighting; Heating | 6 | Expired |
| US6509577B1 | Systems and methods for exposing substrate periphery | Physics | 4 | Expired |
| US10656530B2 | Application of FreeForm MRC to SRAF optimization based on ILT mask optimization | Physics | 3 | Active |
| US7306114B2 | Non-dripping nozzle apparatus | Electricity | 3 | Expired |
| US6667239B2 | Chemical mechanical polishing of copper-oxide damascene structures | Electricity | 3 | Expired |
| US10571799B1 | Hessian-free calculation of product of Hessian matrix and vector for lithography optimization | Physics | 2 | Active |
| US6485783B1 | Chemical vapor deposition system | Chemistry; Metallurgy | 2 | Expired |
| US6576060B1 | Protective gas shield apparatus | Chemistry; Metallurgy | 1 | Expired |
| US11119401B2 | Simulating near field image in optical lithography | Physics | 0 | Active |
| US10578963B2 | Mask pattern generation based on fast marching method | Physics | 0 | Active |
| US10705420B2 | Mask bias approximation | Physics | 0 | Active |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.