Patent · US Expired

Micromechanical cap structure and the respective manufacturing method

US6462392B1 · kind B1 · utility

18Cited by
4References
8Claims
0Family size

Assignee

Inventors

Key dates

Filing dateFeb 5, 2001
Grant dateOct 8, 2002
Priority date
Expiry dateFeb 5, 2021

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB81C2203/0163
  • WIPO fieldMeasurement
  • WIPO sectorInstruments

Abstract

A micromechanical cap structure and a corresponding manufacturing method are described, the cap structure having a substrate, in particular in the form of a wafer, having a cavity made therein. The cavity includes a bottom surface and two pairs of opposite parallel side wall sections. The cavity has at least one stabilizing wall section, which connects two side wall sections. This considerably increases the stability of the cap structure.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.