Patent · US Expired

Electronic device having a multiplicity of contact bumps

US6462407B2 · kind B2 · utility

0Cited by

8References

14Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Uta Gebauer · Hersbruck, DE
Thomas Münch · Hemau, DE
Friedrich Wanninger · Birkenfeld, DE

Key dates

Filing date	Mar 23, 2001
Grant date	Oct 8, 2002
Priority date	—
Expiry date	Mar 23, 2021

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/12044
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

The invention relates to an electronic device having a multiplicity of contact bumps and an intermediate support. In this case, the intermediate support connects the multiplicity of contact bumps to contact areas of a semiconductor chip via a multiplicity of flat conductors which have contact connecting lugs exposed in a bonding channel window of the intermediate support. The contact areas are configured in the bonding channel window via the bonded contact connecting lugs of the flat conductors. The width of the bonding channel window is increasingly greater with increasing distance from the neutral point of the semiconductor chip.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.