Economical packaging for EMI shields on PCB
US6462436B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 13, 1999 |
| Grant date | Oct 8, 2002 |
| Priority date | — |
| Expiry date | Aug 13, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10371
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An economical protective shield assembly of a dielectric substrate and an EMI shield, substantially free of the effects of board coupling and air coupling which requires less hardware for securing an EMI shield than present devices and methods, is provided for. The inventions use of simply finished shield edges with an unimproved substrate having a conductive intermediary interconnected with a grounding path and simply finished or unfinished shield edges with an improved substrate having a mating groove cooperatively adapted to fit the shield edge, interacts to exclude EMI signals and requires less precision in positioning the shield onto the substrate. The invention also provides a simplified method to exclude EMI effects for an assembly by a process of fabrication requiring less finishing steps than present processes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.