Clipping system and method for a graphics processing framework embodied on a single semiconductor platform
US6462737B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 20, 2001 |
| Grant date | Oct 8, 2002 |
| Priority date | — |
| Expiry date | Sep 20, 2021 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T15/506
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A graphics pipeline system is provided with an integrated clipping operation. First included is a transform module adapted for being coupled to a buffer to receive graphics data therefrom. Such transform module is positioned on a single semiconductor platform for transforming the graphics data from a first space to a second space. Also provided is a lighting module coupled to the transform module and positioned on the same single semiconductor platform as the transform module. The lighting module is adapted for performing lighting operations on the graphics data received from the transform module. A range clamp inversion function and a clipping operation are performed on the same single semiconductor platform as the transform module and the lighting module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.