Apparatus for the simultaneous deposition by physical vapor deposition and chemical vapor deposition and method therefor
US6463874B1 · kind B1 · utility
13Cited by
5References
10Claims
0Family size
Assignee
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Key dates
| Filing date | Aug 11, 2000 |
| Grant date | Oct 15, 2002 |
| Priority date | — |
| Expiry date | Aug 11, 2020 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C16/545
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Apparatus and method for the vacuum deposition of at least two different layers of thin film material onto a substrate by two different vacuum deposition processes. Also disclosed is a novel linear applicator for using microwave enhanced CVD to uniformly deposit a thin film of material over an elongated substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.