Pad quick release device for chemical mechanical planarization
US6464574B1 · kind B1 · utility
13Cited by
11References
17Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 20, 2000 |
| Grant date | Oct 15, 2002 |
| Priority date | — |
| Expiry date | Oct 20, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D9/085
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
In a chemical-mechanical planarization apparatus, a pad spindle includes a pad chuck operative for selective attachment and detachment of a polishing pad. The pad chuck includes a plurality of pivoting links which cooperate to provide a clamping action to retain the polishing pad. A detachment station engages the pivoting links to detach the polishing pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.