Electronic component and method of manufacturing
US6465320B1 · kind B1 · utility
19Cited by
6References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 16, 2000 |
| Grant date | Oct 15, 2002 |
| Priority date | — |
| Expiry date | Jul 3, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D1/68
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing an electronic component includes forming first, second, and third capacitors (260, 270, 280) and electrically testing the first, second, and third capacitors to characterize an etch process for a sacrificial layer. Each of the first, second, and third capacitors has different amounts of first and second electrically insulative materials.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.