Method and apparatus for mounting component
US6467670B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 8, 2001 |
| Grant date | Oct 22, 2002 |
| Priority date | — |
| Expiry date | Jan 17, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Sealant 11 is supplied in advance to one or both of the electrical bonding areas 5,6 of the component 3 and the mounting surface 4, and as the component 3 is brought in contact with the mounting surface 4, the sealant 11 is compressed and filled therebetween in a required area. At the same time ultrasonic vibration is applied to the component 3 for generating friction between the electrical bonding areas 5, 6 of the component 3 and the mounting surface 4 in tight contact with each other, so that both electrical bonding areas 5, 6 are melted and ultrasonically bonded together, and thereby the component 3 is mounted on the mounting surface 4.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.