Edge-gripping pre-aligner
US6468022B1 · kind B1 · utility
24Cited by
11References
16Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 5, 2000 |
| Grant date | Oct 22, 2002 |
| Priority date | — |
| Expiry date | Jul 5, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S414/141
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus for holding and orienting a wafer having an alignment feature, and including a movable robot arm; and an end effector attached to an end of the robot arm, the end effector including a gripping mechanism which during operation both holds the wafer and rotates it about an axis that is perpendicular to the plane of the wafer and a sensing element for detecting the alignment feature on the wafer as the gripping mechanism rotates the wafer past the sensing element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.