Method and apparatus for multiphase chemical mechanical polishing
US6468135B1 · kind B1 · utility
8Cited by
27References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 30, 1999 |
| Grant date | Oct 22, 2002 |
| Priority date | — |
| Expiry date | Apr 30, 2019 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB08B3/02
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
The present invention is a method and apparatus for CMP processing that reduces scratching of the insulating film and conductor lines of a wafer. More specifically, the method and apparatus introduce an aqueous solution to the polishing pad and wafer during various intervals of the polishing procedure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.