Method and device for separating a plate of material, in particular semiconductor material, into two wafers
US6468879B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 13, 2001 |
| Grant date | Oct 22, 2002 |
| Priority date | — |
| Expiry date | Aug 13, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T83/748
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
The invention relates to a method of separating into two wafers (2,4) a plate (1) of material for manufacturing substrates for electronics, optics, or optoelectronics, or for manufacturing microsystems, said wafers being situated on either side of a plane of weakness (6), the method being characterized in that it comprises the steps consisting in:exerting a deformation force on at least one of the wafers so as to cause the wafers (2, 4) to separate from each other in a zone of the plate (1) at said plane of weakness; andexerting guided separation movement on the wafers (2, 4).The invention also provides apparatus (100) for implementing the method, which apparatus has gripping members (30, 32) suitable for exerting said deformation force and for performing said separation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.