Ready-to-use stable chemical-mechanical polishing slurries
US6468913B1 · kind B1 · utility
26Cited by
2References
37Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 8, 2000 |
| Grant date | Oct 22, 2002 |
| Priority date | — |
| Expiry date | Jul 8, 2020 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09G1/02
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
In accordance with the invention, there is provided a chemical-mechanical polishing slurry for polishing a substrate. The slurry is comprised primarily of abrasive particles and an oxidizing agent, wherein the slurry exhibits a stability having a shelf life of at least 30 days.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.