Method and apparatus for mounting semiconductor chips
US6471110B1 · kind B1 · utility
11Cited by
12References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 8, 2000 |
| Grant date | Oct 29, 2002 |
| Priority date | — |
| Expiry date | Sep 8, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/014
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
With the mounting of semiconductor chips on a substrate having a solder portion a semiconductor chip held by a gripper spring mounted on a bondhead is lowered onto the substrate. In doing so, the gripper is deflected towards the bondhead. Subsequently, the semiconductor chip is raised by a predetermined distance and then released. Optionally, the semiconductor chip is moved up and down before being released. With this method, the semiconductor chip is under mechanical control until the solder has taken up a stable form and the semiconductor chip has achieved its final position.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.